Why component carriers are now replacing flexible PCBs: Part 2

The component carrier cuts costs by two-thirds and reduces turnaround times.

In this two-part article, HARTING Canada discusses the considerable advantages that component carriers have over flexible printed circuit boards (PCBs). This section deals with the advantages of the company’s new 3D-MID component carrier. Read Part 1 here.

The laser direct structuring (LDS) process creates electrical traces across the three-dimensional base body. The plastic employed offers high thermal stability and can, therefore, be soldered in the re-flow oven.

HARTING has been implementing the entire 3D-MID process chain in house for over ten years, from the project idea all the way to the populated series product. The technology is finding use in application scenarios in areas such as medical technology, industrial electronics, and consumer electronics, as well as safety-related components in the automotive industry. The HARTING 3D-MID business unit is the largest provider of 3D-MID components outside of Asia.

The component carrier developed by this process is suitable for various applications. It can be equipped with several sensors that, if desired, could be aligned in three directions to take measurements on three axes (X, Y, Z). Components can be placed simultaneously on two parallel surfaces on the front and back sides, as well as on the end face. HARTING has submitted a patent application for the component carrier.

In an automated process, HARTING fits electronic components such as LEDs, ICs, photodiodes, and sensors directly on the component carrier. The total cost of the component carrier is two-thirds lower than those of flexible PCB solutions. This is due to the fact that it eliminates the frequently complex handling involved with flexible PCBs (e.g., populating, gluing, and assembling). The process even delivers benefits in small volumes, as the component carrier can be used for different applications without adaptation, thereby eliminating the costs of a new injection mould. Compared to flexible printed circuit boards, this process achieves more precise component positioning, greater repeatability, and better quality.

HARTING has identified another advantage of the component carrier, namely the short time frame required to deliver finished components. Since the plastic carrier remains unchanged, specifications for the placement of the electronic components are all that is needed. Experts in 3D-MID can use this to create a production-optimized layout proposal. Adjustments of the laser program are all that is needed to tailor the electrical traces to the respective application. Once the customer has approved the product and the components have been received, initial production samples can be delivered within two to three weeks – and even faster, if necessary.

About HARTING 3D-MID

To discuss a 3D-MID application, please contact us via phone at 1(866) 278-0306 or via e-mail at TechSupportUS@HARTING.com.

HARTING 3D-MID offers the complete value chain for 3D-MID technologies from a single source. This includes the development/prototyping of customer-specific products, injection molding, laser direct structuring, metallization, assembly and connection technology, and final inspection. Its core business is the production of mechatronic components for automobile manufacturing, industry, medical technology, and sensor systems. HARTING is the largest supplier of 3D-MID components outside of Asia. HARTING 3D-MID is a business unit of the HARTING Technology Group, headquartered in Espelkamp, Germany.

For more information, contact HARTING.

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