Harting launches major expansion of cable assemblies

Harting has unveiled a major expansion of its M8, M12 and ⅞-inch overmoulded cable assembly lineup for data and signal applications, providing customers with the convenience of one-stop shopping for reliable, robust connectivity. 

This largest-ever expansion of Harting assemblies features a number of firsts, including a complete roster of popular M8 versions with both three- and four-pole configurations. Also new: a comprehensive lineup of M12 A-code assemblies used in sensor, actuator and DeviceNet applications, available in four-, five- and eight-pole versions that support two to 12 contacts. 

Harting has also introduced its first-ever M12 12-pole assemblies, in several popular configurations. The M8 and M12 A-code assemblies are available in all common single-ended and dual-ended units: male/male, female/female and male/female, with straight/straight, straight/angled and angled/angled connectors. The M12 12-pole assemblies include double-ended versions of the same connector, a male/female straight connector version, as well as male and female single-ended assemblies. 

The ⅞-inch overmoulded assemblies are available in three-, four- and five-pole versions, angled or straight, single- or double-ended. Harting also offers popular versions of B and D code overmoulded cable assemblies, used in Profibus and Ethernet applications (to 100Mbit/s), respectively.

All Harting M8, M12 and ⅞-inch cable assemblies are IP67 rated and come in standard stocked lengths of 0.5-, one-, 1.5-, two-, five-, 7.5- and 10-metre options. Custom lengths and configurations are also available. All overmoulded assemblies are available in both PVC and PUR jackets.

The Harting Technology Group, family owned and based in Germany, employs approximately 3,900 people globally across more than 40 subsidiaries and branch offices, including one in Saint-Laurent, Que. With production facilities in Europe, Asia and the United States, the company’s portfolio of connectivity solutions focuses on multiple levels, from the machine to the device and into the communication infrastructure. 

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