Master Bond Inc. features an extensive line of epoxies, silicones and elastomeric products with superb thermal conductivity for demanding electronic applications. Many of our formulations boast a thermal conductivity as high as 22-25 BTU·in/ft2·hr·°F [3.17-3.6057 W/(m·K)]. These systems are often utilized for a variety bonding, potting and encapsulation applications, including heat sink bonding, chip scale packages, BGA die heat spreader interface, power semiconductors and potting sensors. We also offer specially formulated adhesives that are designed specifically for unusual service conditions.
Typical properties of thermally conductive compounds
Our thermally conductive systems not only feature enhanced heat dissipation properties, but also superior strength characteristics, electrical insulation, cryogenic serviceability, vibration and impact resistance and chemical resistance. We also offer many adhesives that deliver outstanding electrical conductivity as well as thermal conductivity with addition of nickel, silver coated nickel and silver fillers.
Popular thermally conductive products
Master Bond continues to develop new thermally conductive adhesives that meet a wide variety of challenging application requirements. Some of our more popular thermally conductive systems include: