Master Bond Inc. is a leading manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds. Master Bond offers custom formulations to meet the rigorous needs of the electronics industry, specializing in conformal coatings, glob tops, flip chip underfills, die attach, surface mount and lid sealing.
Epoxies for electrical and electronic assembly such as microwave and RF, printed circuit boards and semiconductor packaging, are designed for ease of use and reliability. The extensive array of epoxy formulations offers engineers a variety of formats and curing characteristics designed to meet different manufacturing needs. Epoxies are available as liquids, pastes, films, and solids.
Performance properties of Master Bond electrical and electronics epoxy adhesives
Formulations can also be modified to achieve a vast assortment of performance characteristics. Among the properties that can be controlled through each specific formulation are thermal conductivity, electrical conductivity, cohesive strength, hardness, durability, flexibility, viscosity and the ability to withstand high and low temperatures, chemicals, moisture, shock and vibration.
Because of their wide range of physical properties, epoxies are often engineered specifically to perform additional functions, such as dissipating heat, providing an electrically conductive pathway between substrates, or relieving stress between substrates. The outstanding performance and versatility of epoxy compounds has proven to be a tremendous asset to the electronics industry.
Master Bond epoxies for the assembly of electronics and electrical devices